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Tangio Formally Announces Multi-Touch NEO

Tangio Formally Announces Multi-Touch NEO

Over recent years Tangio has firmly established a global leadership position in Resistive 3D Multi-Touch sensors, with hundreds of thousands shipped to multiple mass production applications. Today, Tangio further elevates its position in the space with the launch of Multi-Touch NEO, its in-house developed turnkey solution.

NEO is a scalable platform concept which includes sensor, hardware electronics interface and firmware. This end-to-end solution enables Tangio customers to deploy 3D Multi-Touch in their upcoming products quickly and affordably. No longer will they have to develop their own hardware electronics or firmware.

Neil Jarvie, Tangio's VP of Marketing & Business Development commented, "our leadership position in Multi-Touch resistive sensors was unchallenged, but we lacked the interface solution that many customers required. NEO was developed from a customer perspective, making it easily scalable and most importantly affordable. Both were key issues our customers complained were not delivered by our competitors." He concluded, "the team that delivered NEO has over three decades combined experience in Multi-Touch sensing, which resulted in the most flexible and cost-effective solution in market today."

Experience NEO for yourself with Tangio's new TPE-920 demonstration/evaluation board, available to purchase today.

 

Tangio to Launch Revolutionary fuZion Sensor on November 15th

Tangio to Launch Revolutionary fuZion Sensor on November 15th

VANCOUVER, Canada, August 25th 2018 – Tangio Printed Electronics, a division of Sytek Enterprises Inc., a global leader in Printed Touch Sensing Solutions, today announces the simultaneous launch of its revolutionary fuZion sensor at two key industry events in November.

Continuing the philosophy of Affordable-Innovation, Tangio is pleased to announce the launch of its fuZion hybrid sensing technology at the IDTechEx show in Santa Clara California, and the China Hi-Tech Fair in Shenzhen China on November 15th.

FuZion merges two complimentary sensing technologies in a way not previously seen, creating new and exciting HMI possibilities.

Neil Jarvie, Tangio's VP of Business Development commented, “the touch market is demarcated along technology lines, with our competitors typically promoting either resistive or capacitive based products. As the leader in printed touch sensing solutions it seemed obvious for Tangio to combine the best of each in a way that offers seamless integration and enables new and innovative HMI solutions.” He continued, "having shown pre-launch demonstrations to several key OEM's and Tiers we're very excited at the overwhelmingly positive feedback!" He concluded, "and of course with over 30 years manufacturing experience, Tangio is launching fuZion as a ready-to-deploy solution, not a piece of slideware!"

Details of the launch events and where to find Tangio can be found here.

About Tangio Printed Electronics

Tangio, the Printed Electronics division of Sytek Enterprises Inc, is a global leader in the design and manufacture of a wide range of standard and custom touch sensing solutions. From simple high-performance "single point" FSR sensors, through to state-of-the-art 3D multi-touch resistive sensors, capacitive sensors, and other novel innovations in printed electronics. Tangio offers unrivalled levels of integration, enabling customers to add value and reduce costs in their supply chain and get new products to market faster. Tangio’s philosophy of “Affordable Innovation” enables OEM’s and Tiers to deploy next generation HMI solutions in their products today. Tangio is a global company headquartered in Vancouver, Canada, with strategically located internal and partner sites in Europe, SE Asia, and India, supporting a rapidly expanding customer base. For more information go to www.tangio.ca

Tangio Collaborates With Local Universities to Drive Real-Time Innovation

Tangio Collaborates With Local Universities to Drive Real-Time Innovation

Any business is only as good as its people, and at Tangio we have an eye on the future by engaging the finest student talent from our local Universities.

We believe Tangio’s approach is refreshingly different. A unique way of working with our undergraduate interns is driving significant real-time benefits for our customers in the printed touch sensing and integrated HMI markets.

Robin Jeffries, Tangio’s CEO stated, “we’ve been working with the University of British Columbia’s science co-op program for several years as part of our undergraduate intern scheme. We’ve honed our team structure to fully integrate our local student talent.”

Mark Graham, Tangio’s Head of Engineering continued, “our student colleagues are in the thick of the action contributing to actual customer projects and delivery of our technology roadmaps, not tucked away in a back room. Our structure and methodology enables each student to function as a full member of the team with the same contribution to innovation & project delivery as our full-time staff.”

Our unique approach to harnessing undergraduate skills is delivering tangible benefits for Tangio’s customers. This extends beyond the “basic” sensor business to solutions such as Tangio’s in-house developed 3D Multi-Touch interface reference design and the upcoming and game-changing fuZion hybrid sensor family.

Mohammad Olyaiy, an undergraduate who recently completed his internship with Tangio stated, “working at Tangio was an incredibly empowering & enjoyable experience. Being fully integrated into the engineering team allowed me to directly influence project direction and content. Interfacing with the marketing and business development departments gave unique insights into the commercial requirements and impact. Although my official internship has ended I am continuing to work for Tangio on a part-time basis.”

The team at Tangio is proud of the mutual benefits our intern program is delivering, and Neil Jarvie, Tangio’s VP of Business Development concludes, “it’s refreshing to be part of an enabling and inspiring management team delivering real progress and commercial solutions in this exciting HMI sensor space.”

About Tangio Printed Electronics

Tangio, the Printed Electronics division of Sytek Enterprises Inc, is a global leader in the design and manufacture of a wide range of standard and custom touch sensing solutions. From simple high-performance "single point" FSR sensors, through to state-of-the-art 3D multi-touch resistive sensors, capacitive sensors, and other novel innovations in printed electronics. Tangio offers unrivalled levels of integration, enabling customers to add value and reduce costs in their supply chain and get new products to market faster. Tangio’s philosophy of “Affordable Innovation” enables OEM’s and Tiers to deploy next generation HMI solutions in their products today. Tangio is a global company headquartered in Vancouver, Canada, with strategically located internal and partner sites in Europe, SE Asia, and India, supporting a rapidly expanding customer base. For more information go to www.tangio.ca