| 1. | EXECUTIVE SUMMARY | 
| 1.1. | Printed/flexible/organic electronics market | 
| 1.2. | Printed/flexible electronics in automotive applications. | 
| 1.3. | Transitions in the automotive industry | 
| 1.4. | Advantages of roll-to-roll (R2R) manufacturing | 
| 1.5. | What is flexible hybrid electronics (FHE)? | 
| 1.6. | Automotive-relevant attributes of FHE | 
| 1.7. | Printed/flexible electronics in vehicle powertrains. | 
| 1.8. | Battery thermal management: Optimal temperature required | 
| 1.9. | Integrated pressure/temperature sensors and heaters for battery cells | 
| 1.10. | Technological/commercial readiness level of printed/flexible electronics in vehicle powertrains | 
| 1.11. | Vehicle interiors increasingly provide differentiation | 
| 1.12. | Printed/flexible electronics for vehicle interiors | 
| 1.13. | Printed/flexible electronics opportunities from car interior trends | 
| 1.14. | Printed/flexible electronics enables cost differentiation and/or cost reduction | 
| 1.15. | Integrated stretchable pressure sensors | 
| 1.16. | Innovative integration of capacitive touch screens | 
| 1.17. | Hybrid piezoresistive/capacitive sensors | 
| 1.18. | Metallization and materials for each 3D electronics methodology | 
| 1.19. | Motivation for 3D electronics | 
| 1.20. | In-mold electronics: Summary | 
| 1.21. | Printed/flexible electronics in automotive displays and lighting | 
| 1.22. | Technological/commercial readiness level of printed/flexible electronics in vehicle interiors | 
| 1.23. | Printed/flexible electronics for vehicle exteriors | 
| 1.24. | SWIR for autonomous mobility and ADAS | 
| 1.25. | Transparent electronics for ADAS radar | 
| 1.26. | Opportunities for printed/flexible electronics in exterior automotive lighting | 
| 1.27. | Transparent heaters for exterior lighting/sensors/windows | 
| 1.28. | Where are printed/flexible photovoltaics envisaged in cars? | 
| 1.29. | Technological/commercial readiness level of printed/flexible electronics in vehicle exteriors | 
| 1.30. | Global car market forecast by powertrain | 
| 1.31. | Overall forecast: Printed/flexible electronics in automotive applications (volume) | 
| 1.32. | Overall forecast for printed/flexible electronics in automotive applications (volume) (data table) | 
| 1.33. | Overall forecast: Printed/flexible electronics in automotive applications (revenue) | 
| 1.34. | Overall forecast for printed/flexible electronics in automotive applications (revenue) (data table) | 
| 1.35. | Forecast revenue CAGR 2021-2031 | 
| 2. | INTRODUCTION | 
| 2.1.1. | Printed/flexible/organic electronics market | 
| 2.1.2. | Description and analysis of the main technology components of printed, flexible and organic electronics | 
| 2.1.3. | Market potential and profitability | 
| 2.1.4. | Printed/flexible electronics in automotive applications. | 
| 2.1.5. | Transitions in the automotive industry | 
| 2.1.6. | Trends in automotive powertrain adoption | 
| 2.1.7. | Trends in autonomous vehicle adoption | 
| 2.1.8. | What are the levels of automation in cars? | 
| 2.1.9. | Opportunities for printed/flexible electronics in automotive applications | 
| 2.1.10. | Advantages of roll-to-roll (R2R) manufacturing | 
| 2.1.11. | Flexible hybrid electronic (FHE) circuits for automotive applications | 
| 2.1.12. | What is flexible hybrid electronics (FHE)? | 
| 2.1.13. | What counts as FHE? | 
| 2.1.14. | FHE: The best of both worlds? | 
| 2.1.15. | Overcoming the flexibility/functionality compromise | 
| 2.1.16. | Commonality with other electronics methodologies | 
| 2.1.17. | Automotive-relevant attributes of FHE | 
| 2.1.18. | PCB replacement with FHE circuits | 
| 2.2. | Overall market forecasts | 
| 2.2.1. | Forecasting methodology | 
| 2.2.2. | Forecast: Global car market by powertrain | 
| 2.2.3. | Forecast: Global autonomous car market | 
| 2.2.4. | Forecast: Global autonomous car market (data table) | 
| 2.2.5. | Overall forecast: Printed/flexible electronics in automotive applications (volume) | 
| 2.2.6. | Overall forecast: Printed/flexible electronics in automotive applications (volume) (data table) | 
| 2.2.7. | Overall forecast: Printed/flexible electronics in automotive applications (revenue) | 
| 2.2.8. | Overall forecast: Printed/flexible electronics in automotive applications (revenue) (data table) | 
| 2.2.9. | Forecast revenue CAGR 2021-2031 | 
| 2.2.10. | Forecast: Flexible hybrid electronics (FHE) | 
| 2.2.11. | Forecast: Flexible hybrid electronics (data table) | 
| 2.2.12. | Forecast: Printed sensors and heaters for batteries | 
| 2.2.13. | Forecast: TIMs for electric vehicles | 
| 2.2.14. | Forecast: TIMs for electric vehicles (data table) | 
| 2.2.15. | Forecast: HMI technologies | 
| 2.2.16. | Forecast: HMI technologies (data table) | 
| 2.2.17. | Forecast: OLED displays | 
| 2.2.18. | Forecast: OLED displays (data table) | 
| 2.2.19. | Forecast: IME /FIM/Electronics on 3D surfaces | 
| 2.2.20. | Forecast: IME/FIM/Electronics on 3D surfaces (data table) | 
| 2.2.21. | Forecast: Printed heaters for seats and interior (data table) | 
| 2.2.22. | Forecast: Exterior applications of printed/flexible electronics | 
| 3. | PRINTED/FLEXIBLE ELECTRONICS IN ELECTRIC VEHICLE POWERTRAINS | 
| 3.1.1. | Printed/flexible electronics in electric vehicles | 
| 3.2. | Battery monitoring/heating for electric vehicles | 
| 3.2.1. | Introduction to thermal management for electric vehicles | 
| 3.2.2. | Battery thermal management: Optimal temperature required | 
| 3.2.3. | Integrated battery temperature sensing and heating: IEE | 
| 3.2.4. | Printed battery module heater: IEE | 
| 3.2.5. | Silicon nanoparticle ink for temperature sensing (PST Sensors) (II) | 
| 3.2.6. | Printed temperature sensors and heaters | 
| 3.2.7. | InnovationLab: Integrated pressure/temperature sensors and heaters for battery cells | 
| 3.2.8. | SWOT: Temperature control (sensing/heating) for battery systems | 
| 3.2.9. | Temperature control (sensing/heating) for battery systems | 
| 3.3. | Thermal interface materials for electric vehicle powertrains | 
| 3.3.1. | Thermal management materials (TIMs) in automotive applications | 
| 3.3.2. | Thermal management - pack and module overview | 
| 3.3.3. | Why use TIM in power modules? | 
| 3.3.4. | Automotive applications are a harsh environment | 
| 3.3.5. | Thermal greases are still the norm | 
| 3.3.6. | Thermal management of Electronic Control Units (ECUs) | 
| 3.3.7. | Alternatives TIMs: Carbon nanotubes (CNTs) | 
| 3.3.8. | Carbon nanotubes for TIMs: Stanford University | 
| 3.3.9. | Thermoelectric Coolers and Generators | 
| 3.3.10. | Thermoelectric coolers and generators | 
| 3.3.11. | SWOT: Thermal management materials | 
| 3.3.12. | Thermal management  and thermal interface materials | 
| 3.4. | Summary: Printed/flexible electronics in electric vehicle powertrains | 
| 3.4.1. | Technological/commercial readiness level of printed/flexible electronics in vehicle powertrains | 
| 3.4.2. | Forecast: Printed sensors and heaters for batteries | 
| 3.4.3. | Forecast: TIMs for electric vehicles | 
| 3.4.4. | Forecast: TIMs for electric vehicles (data table) | 
| 4. | PRINTED/FLEXIBLE ELECTRONICS IN VEHICLE INTERIORS | 
| 4.1.1. | Vehicle interiors increasingly provide differentiation | 
| 4.1.2. | Printed / flexible electronics in car interiors | 
| 4.1.3. | Evolution of car interiors: 1950s - 1980s | 
| 4.1.4. | Evolution of car interiors: 1990s - today | 
| 4.1.5. | Evolution of car interiors: today - future | 
| 4.1.6. | Printed/flexible electronics opportunities from car interior trends | 
| 4.1.7. | Printed/flexible electronics enables cost differentiation and/or cost reduction | 
| 4.2. | Human machine interface (HMI) technologies | 
| 4.2.1. | Company profiles: HMI Sensors | 
| 4.2.2. | Piezoresistive sensors | 
| 4.2.3. | Printed piezoresistive sensors: An introduction | 
| 4.2.4. | Automotive applications for printed piezoresistive sensors | 
| 4.2.5. | Automotive seat occupancy sensors | 
| 4.2.6. | What are force sensing resistors (FSR)? | 
| 4.2.7. | What is piezoresistance? | 
| 4.2.8. | Percolation dependent resistance | 
| 4.2.9. | Thru-mode sensors | 
| 4.2.10. | Shunt mode sensors | 
| 4.2.11. | Force vs resistance characteristics | 
| 4.2.12. | Piezoresistive inks for force sensitive resistors | 
| 4.2.13. | Complete material portfolio approach is common | 
| 4.2.14. | IEE: Seat occupancy sensors | 
| 4.2.15. | ForcIOT: Integrated stretchable pressure sensors | 
| 4.2.16. | Tangio: 3D multi-touch pressure sensors | 
| 4.2.17. | Tekscan: Matrix pressure sensor architecture | 
| 4.2.18. | Piezoresistive sensors in car seats | 
| 4.2.19. | InnovationLab: Spatially resolved flexible pressure sensor | 
| 4.2.20. | Technological development of piezoresistive sensors. | 
| 4.2.21. | Business models for printed piezoresistive sensors | 
| 4.2.22. | SWOT: Piezoresistive sensors | 
| 4.2.23. | Capacitive sensors | 
| 4.2.24. | Capacitive sensors: Working principle | 
| 4.2.25. | TG0: Integrated capacitive sensing | 
| 4.2.26. | Rotary dial on a capacitive touch screen | 
| 4.2.27. | Conductive materials for transparent capacitive sensors | 
| 4.2.28. | Quantitative benchmarking of different TCF technologies | 
| 4.2.29. | Technology comparison | 
| 4.2.30. | Silver nanowires: An introduction | 
| 4.2.31. | Properties of silver nanowires | 
| 4.2.32. | Combining AgNW and CNTs for a TCF material (Chasm) | 
| 4.2.33. | Metal mesh: Photolithography followed by etching | 
| 4.2.34. | Direct printed metal mesh transparent conductive films: performance | 
| 4.2.35. | Direct printed metal mesh transparent conductive films: major shortcomings | 
| 4.2.36. | Introduction to Carbon Nanotubes (CNT) | 
| 4.2.37. | Carbon nanotube transparent conductive films: performance of commercial films on the market | 
| 4.2.38. | Carbon nanotube transparent conductive films: mechanical flexibility | 
| 4.2.39. | PEDOT:PSS | 
| 4.2.40. | Performance of PEDOT:PSS has drastically improved | 
| 4.2.41. | Use case examples of PEDOT:PSS TCF for capacitive touch sensors | 
| 4.2.42. | SWOT: Printed/flexible capacitive sensors | 
| 4.2.43. | Hybrid piezoresistive/capacitive sensors | 
| 4.2.44. | Tangio: Hybrid FSR/capacitive sensors | 
| 4.2.45. | Curved sensors with consistent zero (Tacterion) | 
| 4.2.46. | Tacterion: Flexible combined force/capacitive sensing | 
| 4.2.47. | Summary: Printed piezoresistive sensor applications | 
| 4.2.48. | SWOT: Hybrid piezoresistive / capacitive sensors | 
| 4.2.49. | Piezoelectric sensors | 
| 4.2.50. | Piezoelectric sensors: An introduction | 
| 4.2.51. | Printed piezoelectric sensor | 
| 4.2.52. | Piezoelectric polymers | 
| 4.2.53. | PVDF-based polymer options for sensing and haptic actuators | 
| 4.2.54. | Piezoelectric polymers sensors: Pyzoflex | 
| 4.2.55. | Meggitt: Inorganic piezoelectric inks | 
| 4.2.56. | SWOT: Piezoelectric sensors | 
| 4.3. | Printed/flexible interior heaters | 
| 4.3.1. | Printed car seat heaters | 
| 4.3.2. | Car seat heaters | 
| 4.3.3. | Graphene inks are a potential substitute? | 
| 4.3.4. | Transparent circuits as car interior heaters | 
| 4.3.5. | Transparent circuits as car interior heaters (continued) | 
| 4.3.6. | Company profiles: Printed/flexible interior heaters | 
| 4.3.7. | SWOT: Printed/flexible interior heaters | 
| 4.4. | Emerging manufacturing methodologies for integrating electronics | 
| 4.4.1. | Metallization and materials for each 3D electronics methodology | 
| 4.4.2. | 3D electronics manufacturing method flowchart | 
| 4.4.3. | HMI: Trend towards 3D touch surfaces | 
| 4.4.4. | Company profiles: Emerging manufacturing methodologies | 
| 4.4.5. | Printing electronics onto 3D surfaces | 
| 4.4.6. | 3D electronics requires special electronic design software | 
| 4.4.7. | Advantages of 3D electronics vs conventional PCBs | 
| 4.4.8. | Motivation for 3D electronics | 
| 4.4.9. | Comparing selective metallization methods | 
| 4.4.10. | Aerosol deposition onto 3D surfaces | 
| 4.4.11. | Replacing wiring bundles with printed electronics | 
| 4.4.12. | Comparison of metallization methods | 
| 4.4.13. | SWOT: Electronics onto 3D surfaces | 
| 4.4.14. | Summary: Electronics onto 3D surfaces | 
| 4.4.15. | In-mold electronics (IME) and film-insert molding (FIM) | 
| 4.4.16. | In-mold electronics: Summary | 
| 4.4.17. | Manufacturing in-mold electronics (IME)? | 
| 4.4.18. | What is the in-mold electronic process? | 
| 4.4.19. | Motivation for IME in automotive applications | 
| 4.4.20. | In-mold electronic application: Automotive | 
| 4.4.21. | Addressable market in vehicle interiors in 2020 and 2025 | 
| 4.4.22. | Automotive: In-mold decoration product examples | 
| 4.4.23. | Case study: Ford and T-ink | 
| 4.4.24. | Automotive: Human machine interfaces | 
| 4.4.25. | Stretchable conductive inks for in-mold electronics | 
| 4.4.26. | In-mold conductive inks on the market | 
| 4.4.27. | Printed and thermoformed overhead console | 
| 4.4.28. | Covestro: Plastics for IME | 
| 4.4.29. | Plastic Electronic: Film insert molding | 
| 4.4.30. | PolyIC: Film insert molding | 
| 4.4.31. | Molex: Capacitive touch panel with backlighting | 
| 4.4.32. | SWOT: In-mold electronics (IME) and film-insert molding (FIM) | 
| 4.5. | Interior displays and lighting | 
| 4.5.1. | Mercedes-Benz: 3 screens mounted collectively | 
| 4.5.2. | Increased adoption of large displays and lighting | 
| 4.5.3. | Company profiles: Interior displays and lighting | 
| 4.5.4. | OLED and flexible displays | 
| 4.5.5. | OLED displays for automotive applications | 
| 4.5.6. | Where are OLED displays used in automotive applications? | 
| 4.5.7. | Visteon: Curved screens in automotive interiors | 
| 4.5.8. | ROYOLE: Flexible OLED displays for gauge clusters | 
| 4.5.9. | Passive-matrix OLEDs | 
| 4.5.10. | Active matrix OLED in automotive applications | 
| 4.5.11. | Transparent OLED for heads-up displays | 
| 4.5.12. | Flexible LCD displays | 
| 4.5.13. | SWOT: OLED and flexible displays | 
| 4.5.14. | Emerging display and lighting technologies for automotive interiors | 
| 4.5.15. | Printed/flexible electronics in automotive displays and lighting | 
| 4.5.16. | Micro-LED in automotive displays | 
| 4.5.17. | Comparisons of LEDs for displays | 
| 4.5.18. | Integrating lighting and e-textiles | 
| 4.5.19. | Printed LED lighting (NthDegree) | 
| 4.5.20. | SWOT: Emerging display and lighting technologies | 
| 4.6. | Summary: Printed/flexible electronics in vehicle interiors | 
| 4.6.1. | Summary: Printed/flexible electronics in vehicle interiors | 
| 4.6.2. | Technological/commercial readiness level of printed/flexible electronics in vehicle interiors | 
| 4.6.3. | Forecast: HMI technologies | 
| 4.6.4. | Forecasts: HMI technologies (data table) | 
| 4.6.5. | Forecast: OLED displays | 
| 4.6.6. | Forecasts: OLED displays (data table) | 
| 4.6.7. | Forecast: IME /FIM/Electronics on 3D surfaces | 
| 4.6.8. | Forecast: IME/FIM/Electronics on 3D surfaces (data table) | 
| 4.6.9. | Forecast: Printed heaters for seats and interior (data table) | 
| 5. | PRINTED/FLEXIBLE ELECTRONICS IN VEHICLE EXTERIORS | 
| 5.1.1. | Printed/flexible electronics in vehicle exteriors | 
| 5.2. | Hybrid SWIR image sensors | 
| 5.2.1. | SWIR for autonomous mobility and ADAS | 
| 5.2.2. | Other SWIR benefits: Better hazard detection | 
| 5.2.3. | Types of printed photodetectors/image sensors | 
| 5.2.4. | SWIR: Incumbent and emerging technology options | 
| 5.2.5. | Existing long wavelength detection: InGaAs | 
| 5.2.6. | OPD on CMOS hybrid image sensors | 
| 5.2.7. | Fraunhofer FEP: SWIR OPD-on-CMOS sensors | 
| 5.2.8. | Quantum dots as optical sensor materials | 
| 5.2.9. | Hybrid quantum dots for SWIR imaging | 
| 5.2.10. | QD-Si hybrid image sensors: Reducing thickness | 
| 5.2.11. | QD-Si hybrid image sensors: Low power and high sensitivity to structured light detection for machine vision? | 
| 5.2.12. | Advantage of solution processing: Ease of integration with a silicon ROIC | 
| 5.2.13. | Quantum dot films: Processing challenges | 
| 5.2.14. | How is the QD layer applied? | 
| 5.2.15. | Emberion: QD-Graphene-Si broad range SWIR sensor | 
| 5.2.16. | QD-on-CMOS integration examples (IMEC) | 
| 5.2.17. | Challenges for QD-Si technology for SWIR imaging. | 
| 5.2.18. | QD-on-CMOS sensors ongoing technical challenges | 
| 5.2.19. | Comparing SWIR image sensors technologies | 
| 5.2.20. | Technology readiness level snapshot of printed image sensors | 
| 5.2.21. | SWOT: Hybrid SWIR image sensors | 
| 5.2.22. | Company profiles: SWIR imaging with hybrid sensors | 
| 5.3. | Integrated antenna (including for radar) | 
| 5.3.1. | Transparent electronics for ADAS radar | 
| 5.3.2. | Radar integrated into headlights | 
| 5.3.3. | Radar integrated into headlights (continued) | 
| 5.3.4. | SWOT: Integrated antennas with printed electronics | 
| 5.3.5. | Company profiles: Integrated antennas | 
| 5.4. | Exterior lighting | 
| 5.4.1. | Opportunities for printed/flexible electronics in exterior automotive lighting | 
| 5.4.2. | OLED lighting | 
| 5.4.3. | Commercializing OLED lighting is more challenging than OLED displays | 
| 5.4.4. | OLED taillights commercialized | 
| 5.4.5. | Comparing OLED and LED lighting | 
| 5.4.6. | Konica Minolta develops R2R line | 
| 5.4.7. | Mini-LEDs on flexible substrates for automotive lighting. | 
| 5.4.8. | Flexbright mount LEDs on flexible substrates for bus/tram destination boards. | 
| 5.4.9. | Lighting for autonomous car-to-person communication | 
| 5.4.10. | SWOT: Flexible/printed exterior lighting | 
| 5.4.11. | Company profiles: Exterior lighting | 
| 5.4.12. | Transparent heaters for exterior lighting / sensors / windows | 
| 5.5. | Transparent heaters for exterior lighting/sensors/windows | 
| 5.5.1. | Automotive de-foggers are an established business | 
| 5.5.2. | Printing on polycarbonate car windows. | 
| 5.5.3. | Printed on-glass heater: digital printing comes of age? | 
| 5.5.4. | Key suppliers for rear window defoggers | 
| 5.5.5. | Growing need for 3D shaped transparent heater in automotive | 
| 5.5.6. | Direct heating of headlamp plastic covers | 
| 5.5.7. | Laser transfer printing as a new process for vehicle glass printing | 
| 5.5.8. | Metal mesh transparent conductors as replacement for printed heaters? | 
| 5.5.9. | Chasm: Transparent heaters with silver nanowires/CNTs | 
| 5.5.10. | Carbon nanotube transparent conductors as replacement for printed heaters? | 
| 5.5.11. | SWOT: Transparent heaters for exterior lighting / sensors / windows | 
| 5.5.12. | Company profiles: Transparent exterior heaters | 
| 5.6. | Printed/flexible photovoltaics | 
| 5.6.1. | Where are printed/flexible photovoltaics envisaged in cars? | 
| 5.6.2. | Webasto: Semi-transparent solar PV roof | 
| 5.6.3. | Lightyear: Long range solar electric vehicle | 
| 5.6.4. | Toyota develop solar powered car | 
| 5.6.5. | Hyundai introduces silicon solar panels on roofs. | 
| 5.6.6. | Sono Motors develop solar powered car | 
| 5.6.7. | Tandem silicon-perovskite solar cells increase efficiency | 
| 5.6.8. | Challenges in the adoption of PV in automotive applications | 
| 5.6.9. | Company profiles: PV in automotive applications | 
| 5.7. | Summary: Printed/flexible electronics in vehicle exteriors | 
| 5.7.1. | Summary: Exterior | 
| 5.7.2. | Technological/commercial readiness level of printed/flexible electronics in vehicle exteriors | 
| 5.7.3. | Forecast: Exterior applications of printed/flexible electronics |